Features
Main features of wafer biscuit crushing machine:
1. Smashing machine is used for collection of wafer biscuits from the cutting machine.
2. During the wafer line there is wastage from the cutting process which needs to be reused in order to minimize the overall wastage of wafer baking systerm which is about 2%.
3. This equipment is used to grind the discarded wafer in to reusable form. The ground material can be used with cream as additive depending onthe requirement.
4. The smashing or grinding machine is constructed out of high quality stainless steel material to maintain hygiene of reusable product. The grinding systerm is driven by 3kW motor to have high power and efficiency.
Technical Data
Model | GGYDL-10 |
Capacity | 250-300pcs/h |
Power | 5KW |
Voltage | 220V |
Weight | 200KG |
Size | 870*700*1400 mm |
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